MARC details
| 000 -LEADER |
|---|
| fixed length control field |
02295nam a2200385Ki 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20250919002841.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
150330s2014 njua oi 001 0 eng |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9789814508599 |
| Qualifying information |
hardback |
| Terms of availability |
RM478.72 |
| 039 #9 - LEVEL OF BIBLIOGRAPHIC CONTROL AND CODING DETAIL [OBSOLETE] |
|---|
| Level of rules in bibliographic description |
201509020854 |
| Level of effort used to assign nonsubject heading access points |
hayat |
| Level of effort used to assign subject headings |
201507221509 |
| Level of effort used to assign classification |
lan |
| Level of effort used to assign subject headings |
201507090913 |
| Level of effort used to assign classification |
haiyati |
| Level of effort used to assign subject headings |
201507090912 |
| Level of effort used to assign classification |
haiyati |
| y |
03-30-2015 |
| z |
rahah |
| 040 ## - CATALOGING SOURCE |
|---|
| Original cataloging agency |
NST |
| Language of cataloging |
eng |
| Description conventions |
rda |
| -- |
pn |
| Transcribing agency |
NST |
| Modifying agency |
STF |
| -- |
OCLCO |
| -- |
OCLCF |
| -- |
UKM |
| Description conventions |
rda |
| 090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN) |
|---|
| Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) |
TK7874.893.S836 3 |
| 090 ## - LOCALLY ASSIGNED LC-TYPE CALL NUMBER (OCLC); LOCAL CALL NUMBER (RLIN) |
|---|
| Classification number (OCLC) (R) ; Classification number, CALL (RLIN) (NR) |
TK7874.893 |
| Local cutter number (OCLC) ; Book number/undivided call number, CALL (RLIN) |
.S836 3 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Swaminathan, Madhavan, |
| Relator term |
author. |
| 245 10 - TITLE STATEMENT |
|---|
| Title |
Design and modeling for 3D ICs and interposers / |
| Statement of responsibility, etc. |
by Madhavan Swaminathan, Ki Jin Han. |
| 264 #1 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Place of production, publication, distribution, manufacture |
Hackensack, NJ : |
| Name of producer, publisher, distributor, manufacturer |
World Scientific, |
| Date of production, publication, distribution, manufacture, or copyright notice |
[2014]. |
| 264 #4 - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE |
|---|
| Date of production, publication, distribution, manufacture, or copyright notice |
©2014. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
1 online resource (200 pages). |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
xxi, 354 pages : |
| Other physical details |
some colour illustrations, pictures ; |
| Dimensions |
23 cm. |
| 336 ## - CONTENT TYPE |
|---|
| Content type term |
text |
| Source |
rdacontent |
| 337 ## - MEDIA TYPE |
|---|
| Media type term |
computer |
| Source |
rdamedia |
| 338 ## - CARRIER TYPE |
|---|
| Carrier type term |
online resource |
| Source |
rdacarrier |
| 490 1# - SERIES STATEMENT |
|---|
| Series statement |
WSPC series in advanced integration and packaging ; |
| Volume/sequential designation |
2 |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc. note |
Includes index. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc. |
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the silicon via (TSV) and glass via (TGV) technology, the book introduces 3D ICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name entry element |
Three-dimensional integrated circuits. |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE |
|---|
| Uniform title |
WSPC series in advanced integration and packaging ; |
| Volume/sequential designation |
2 |
| 907 ## - LOCAL DATA ELEMENT G, LDG (RLIN) |
|---|
| a |
.b16108814 |
| b |
2019-11-12 |
| c |
2019-11-12 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Koha item type |
AM |
| Suppress in OPAC |
No |
| Call number prefix |
TK7874.893.S836 3 |
| 914 ## - VTLS Number |
|---|
| VTLS Number |
vtls003582452 |
| 990 ## - EQUIVALENCES OR CROSS-REFERENCES [LOCAL, CANADA] |
|---|
| Link information for 9XX fields |
nh |
| 991 ## - LOCAL NOTE (NAMA FAKULTI/INSTITUT/PUSAT) |
|---|
| a |
Fakulti Kejuruteraan dan Alam Bina |
| 998 ## - LOCAL CONTROL INFORMATION (RLIN) |
|---|
| Library |
PERPUSTAKAAN LINGKUNGAN KEDUA |
| Operator's initials, OID (RLIN) |
2015-04-03 |
| Cataloger's initials, CIN (RLIN) |
m |
| Material Type (Sierra) |
Printed Books |
| Language |
English |
| Country |
|
| -- |
0 |
| -- |
.b16108814 |
