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Fabrication of a new printing ink with Bimetal system containing tin and silver for leadframe integrated circuit packaging

Lai, Chin Yung,

Fabrication of a new printing ink with Bimetal system containing tin and silver for leadframe integrated circuit packaging Lai Chin Yung. - xxiii, 183 pages : illustrations ; 30 cm.

Tesis sedang dalam proses di Unit Katalog, PTSL dan telah dihantar pada 7.7.2017.

Thesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2016.

References : page 169-182.

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations.

Subjects--Topical Terms:
ink-jet printing.
Tin.
Printing ink.
Silver.
Dissertations, Academic--Malaysia.

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Fabrication of a new printing ink with Bimetal system containing tin and silver for leadframe integrated circuit packaging

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