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Elektropengendapan aloi nanostruktur Co-Ni-Cu menggunakan surfaktan alkil poliglukosida /

Setia Budi,

Elektropengendapan aloi nanostruktur Co-Ni-Cu menggunakan surfaktan alkil poliglukosida / Setia Budi. - xiii, 87 pages : illustrations ; 30 cm.

Tesis (Sarjana Sains)-Universiti Kebangsaan Malaysia, 2010.

Rujukan : mukasurat [77]-86.

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations.

Subjects--Topical Terms:
Dissertations, Academic--Malaysia.
Surface active agents.
Electroplating.
Nanostructures.

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Elektropengendapan aloi nanostruktur Co-Ni-Cu menggunakan surfaktan alkil poliglukosida /

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