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An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages /

Wong, Tszu Ling,

An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages / Wong Tzu Ling. - xiv, 85 pages : some colour illustrations ; 30 cm.

Thesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2012.

References : pages [76]-79.

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations.

Subjects--Topical Terms:
Dissertations, Academic--Malaysia.
Flip chip technology.
Copper.
Electronic packaging.

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An investigation on mechanical properties of tin-silver copper and tin-silver lead-free solder sphere used in FCPBGA electronic packages /

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