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Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN)

Saidatul Azura Radzi.

Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) [microform] / Saidatul Azura binti Radzi. - Bangi: Perpustakaan Tun Seri Lanang, 2013 - xv, 96 p. : ill. , photographs, samples ; 30 cm.

Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011.

Rujukan : p. [89]-93.

ISBN: Hadiah

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations.

Subjects--Topical Terms:
Electric currents.
Metal bonding.
Wire bonding (Electronic packaging).
Dissertations, Academic--Malaysia.

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Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN)

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