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Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /

Saidatul Azura Radzi.

Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) / Saidatul Azura binti Radzi. - 2011. - xv, 96 p. : ill. , photographs, samples ; 30 cm.

Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011.

Rujukan : p. [89]-93.

ISBN: Hadiah

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations.

Subjects--Topical Terms:
Electric currents.
Metal bonding.
Wire bonding (Electronic packaging).
Dissertations, Academic--Malaysia.

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Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /

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