Normal view MARC view ISBD view

Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN

Mohamad Firdaus Rosle

Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN [microform] / Mohamad Firdaus bin Rosle - Universiti Kebangsaan Malaysia, Bangi : 2012 - 1 microfilm reel : positive ; 2012

Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2010

Rujukan : p. [113]-121

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations

Subjects--Topical Terms:
Wire bonding (Electronic packaging)
Electronic packaging
Dissertations, Academic--Malaysia

Place hold
Print
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)

Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN

Contact Us

Copyright ©The National University of Malaysia Library