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Solder joint reliability prediction for multiple environments

Perkins, Andrew E.

Solder joint reliability prediction for multiple environments [electronic resource] / by Andrew E. Perkins, Suresh K. Sitaraman. - Boston, MA : Springer Science+Business Media, LLC, 2009. - xv, 192 pages : illustrations, digital.

ISBN: 9780387793948

Subjects--Topical Terms:
Electronic apparatus and appliances--Reliability.
Joints (Engineering)--Reliability.
Solder and soldering.
Electronics and Microelectronics, Instrumentation.
Metallic Materials.
Optical and Electronic Materials.
Quality Control, Reliability, Safety and Risk.

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Solder joint reliability prediction for multiple environments

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