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Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /

Mohamad Firdaus Rosle

Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN / Mohamad Firdaus bin Rosle - 2010 - xvi, 131 p. : ill. ; 30 cm.

Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2010

Rujukan : p. [113]-121

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations

Subjects--Topical Terms:
Wire bonding (Electronic packaging)
Electronic packaging
Dissertations, Academic--Malaysia

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Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /

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