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RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging [electronic resource] / edited by Ken Kuang, Franklin Kim, Sean S. Cahill. - Boston, MA : Springer Science+Business Media, LLC, 2010. - xiv, 284 p. : ill., digital.

ISBN: 9781441909848 (electronic bk.)

Subjects--Topical Terms:
Microelectronic packaging.
Circuits and Systems
Microwaves, RF and Optical Engineering
Electronics and Microelectronics, Instrumentation
Engineering

Dewey Class. No.: 621.381046

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RF and Microwave Microelectronics Packaging

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