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RF and microwave microelectronics packaging /

RF and microwave microelectronics packaging / Ken Kuang, Franklin Kim, Sean S. Cahill, editors - Heidelberg : Springer, 2009 - xvi, 285 p. : ill. ; 24 cm.

ISBN: 9781441909831 RM378.71

Subjects--Topical Terms:
Multichip modules (Microelectronics)
Microelectronic packaging

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