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Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /

Muhammad Najib Harif

Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor / Muhammad Najib bin Harif - 2008 - xii, 117 p. : charts, ill. ; 30 cm.

Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2008

Rujukan : p. 80-86

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations

Subjects--Topical Terms:
Dissertations, Academic--Malaysia
Solder and soldering
Lead-free electronics manufacturing processes
Ball grid array technology

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Keboleharapan penyambung bahan pateri bebas plumbum menggunakan kaedah ujian penarik bebola di dalam pakej semikonduktor /

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