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Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /

Ibrahim Ahmad

Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) / Ibrahim Bin Ahmad - Bangi : Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, 2007 - xviii, 163 p. : ill. ; 30 cm.

Tesis (Ph.D.) - Universiti Kebangsaan Malaysia, 2007

Rujukan : p. [149] - 159

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations

Subjects--Topical Terms:
Dissertations, Academic--Malaysia
Lead free electronics manufacturing processes
Solder and soldering
Alloys

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Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /

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