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Bonding in Microsystem Technology

Dziuban, Jan A.

Bonding in Microsystem Technology [electronic resource] / by Jan A. Dziuban. - Dordrecht : Springer, 2006. - xviii, 331 p. : ill., digital ; 25 cm. - Springer Series in Advanced Microelectronics, 24 1437-0387 ; .

ISBN: 9781402045899 (electronic bk.)

Subjects--Topical Terms:
Microtechnology.
Micromachining.
Engineering.
Optical and Electronic Materials.
Electronics and Microelectronics, Instrumentation.
Physics and Applied Physics in Engineering.
Continuum Mechanics and Mechanics of Materials.
Operating Procedures, Materials Treatment.

LC Class. No.: TK7874 / .D95 2006

Dewey Class. No.: 620.5

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