Materials for Information Technology Devices, Interconnects and Packaging /
Materials for Information Technology Devices, Interconnects and Packaging / [electronic resource] :
edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick.
- London : Springer-Verlag London Limited, 2005.
- xix, 508 p. : ill., digital ; 24 cm.
- Engineering Materials and Processes, 1619-0181 .
9781846282355 (electronic bk.) 9781852339418 (paper)
Microelectronics--Materials--Congresses.
Information technology--Congresses.
Engineering.
Metallic Materials.
Ceramics, Glass, Composites, Natural Methods.
Surfaces and Interfaces, Thin Films.
Electronics and Microelectronics, Instrumentation.
Physics and Applied Physics in Engineering.
Solid State Physics and Spectroscopy.
TK7874 / .E75 2003
621.381
9781846282355 (electronic bk.) 9781852339418 (paper)
Microelectronics--Materials--Congresses.
Information technology--Congresses.
Engineering.
Metallic Materials.
Ceramics, Glass, Composites, Natural Methods.
Surfaces and Interfaces, Thin Films.
Electronics and Microelectronics, Instrumentation.
Physics and Applied Physics in Engineering.
Solid State Physics and Spectroscopy.
TK7874 / .E75 2003
621.381