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Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) /

Siti Hajar Abdullah

Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) / Siti Hajar Abdullah - Bangi : Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, 2007 - xix, 124 p. : ill. ; 30 cm.

Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2007

Rujukan : p. [111]-120

ISBN: Hadiah

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations

Subjects--Topical Terms:
Dissertations, Academic--Malaysia
Integrated circuits--Wafer--scale integration
Semiconductor wafers

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Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) /

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