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Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices

Mohd. Salleh Ismail

Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices [microform] / by Mohd Salleh Ismail - Davis, Calif. Perpustakaan Tun Seri Lanang, 2006 - 1 microfilm reel ; 35 mm.

Thesis (Doctor of Philosophy) - University of California, 1993

Subjects--Topical Terms:
Semiconductor wafers
Integrated circuits--Water--scale integration

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Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices

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