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Force sensors for microelectronic packaging applications /

Schwizer, Juerg.

Force sensors for microelectronic packaging applications / J. Schwizer, M. Mayer, O. Brand. - Berlin : Springer-Verlag, 2004. - viii, 178 p. : ill. ; 24 cm. - Microtechnology and mems .

Includes bibliographies and index

ISBN: 3540221875 (alk. paper) RM 477.63

Subjects--Topical Terms:
Microelectronic packaging.
Wire bonding (Electronic packaging)

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Force sensors for microelectronic packaging applications /

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