Characterization of integrated circuit packaging materials /

Characterization of integrated circuit packaging materials / editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick - Boston : Butterworth-Heinemann, 1993 - 274 p. : ill. ; 25 cm. - Materials characterization series .

0750692677

93-007685


Electronic packaging--Materials
Integrated circuits--Design and construction

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