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A study of wire bonded Cu-A1 in microelectronics packaging

Tan, Chee Wei

A study of wire bonded Cu-A1 in microelectronics packaging [microform] / Tan Chee Wei - Bangi : Perpustakaan Tun Seri Lanang, 2004 - 1 microfilm reel ; 35 mm.

Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2002

Subjects--Corporate Names:
Universiti Kebangsaan Malaysia--Dissertations

Subjects--Topical Terms:
Microelectronic packaging
Microeclectronic packaging--Technological innovations

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A study of wire bonded Cu-A1 in microelectronics packaging

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