Microvias : for low-cost, high-density interconnects /

Lau, John H.

Microvias : for low-cost, high-density interconnects / John H. Lau, S.W. Ricky Lee - New York : McGraw-Hill, 2001 - xxiii, 565 p. : ill. ; 24 cm.

0071363270 RM401.80


Microelectronic packaging
Integrated circuits--Design and construction--Cost control
Semiconductors--Junctions
Printed circuits

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