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Thermal stress and strain in microelectronics packaging

Thermal stress and strain in microelectronics packaging edited by John H. Lau - New York Van Nostrand Reinhold 1993 - xxii, 883 p. : ill. ; 23 cm.

ISBN: 0442010583

LCCN: 92-43285

Subjects--Topical Terms:
Electronic packaging
microelectronic packaging
Thermal stresses

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Thermal stress and strain in microelectronics packaging

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