Normal view MARC view ISBD view

Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly /

Hwang, Jennie S.

Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly / Jennie S. Hwang - New York : Van Nostrand Reinhold, 1992 - 456 p. : ill. ; 23 cm.

ISBN: 0442013531

Subjects--Personal Names:
Surface mount technology

Subjects--Topical Terms:
Printed circuits--Design and construction
Solder pastes

Place hold
Print
Save record
BIBTEX Dublin Core MARCXML MARC (non-Unicode/MARC-8) MARC (Unicode/UTF-8) MARC (Unicode/UTF-8, Standard) MODS (XML) RIS ISBD
More searches

Search for this title in:
Other Libraries (WorldCat) Other Databases (Google Scholar) Online Stores (Bookfinder.com) Open Library (openlibrary.org)

Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly /

Contact Us

Copyright ©The National University of Malaysia Library